10.0 mil (0.25 mm) thermally conductive adhesive transfer tape for mounting thermoelectric cooling modules, bonding heat sinks to microprocessors, bonding TAB-mounted IC and power transistor to PCB, and power transistor to heat sink.
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Thermally conductive adhesive transfer tapes are used to mechanically and thermally bond electronic components (packages and flexible circuits) to heat sinks or heat sensors. These tapes allow for easy joining of many substrates with light pressure in just seconds at room temperature. See the application selection table below to determine the proper 3M tape. They are permanently tacky tapes Full Text . . .
10.0 mil thermally conductive adhesive on 2.0 mil, polyester liner. For mounting thermoelectric cooling modules, bonding heat sinks to microprocessors, bonding TAB-mounted IC and power transistor to PCB, and power transistor to heat sink.
10.0 mil thermally conductive adhesive on 2.0 mil, polyester liner. For mounting thermoelectric cooling modules, bonding heat sinks to microprocessors, bonding TAB-mounted IC and power transistor to PCB, and power transistor to heat sink.
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