Unsupported, thermosetting film adhesive. Designed for the structural bonding of metals and glass. Heat-curing film adhesive with outstanding "T" Peel strength for metal to metal and metal to glass or ceramic bonding.
Developed for structural bonding of metals, high-strength plastic laminates (epoxy and phenolic) and honeycomb sandwich assemblies. Features: Heat-curing film adhesive with 250 Degree F curing cycle. Bonds metal to metal and metal to honeycomb.
Printer-friendly format