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Bulk conductivity is accomplished through the loading of thermally conductive particles, as well as through control of the thickness of the adhesive. Interface conductivity is provided through superior 3M adhesive technology, which provides a tight coupling between the adhesive and the bonding substrate.
2.0 mil (0.05 mm) thermally conductive adhesive transfer tape for mounting flexible heating foils, temperature indicating films and thermoelectric cooling modules, as well as bonding flexible circuits to heat sinks.
5.0 mil (0.13 mm) thermally conductive adhesive transfer tape for mounting thermoelectric cooling modules, bonding flexible circuits to heat sinks, bonding heat sinks to microprocessors and bonding TAB-mounted IC to PCB.
10.0 mil (0.25 mm) thermally conductive adhesive transfer tape for mounting thermoelectric cooling modules, bonding heat sinks to microprocessors, bonding TAB-mounted IC and power transistor to PCB, and power transistor to heat sink.
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