|
|
 Make a Selection |
|
|
3M™ MetPak™ 2-FB Inverse Connectors
High density, user accessible, Backplane receptacle and PCB mounted header. 2mm X 2mm grid, 5 row modular connector system. 30-420 pin counts. Ideal for "hot swap" applications.
|
|
|
3M™ MetPak™ 2-FB Standard Connectors
High-density, 2 mm backplane connector system. 4-row (24-192 pos.) and 5-row (30-240 pos.). Meets IEC 61076-4-104 and IEC 917 specifications for Futurebus+®. Tested to Telcordia specifications. Standard and inverse applications. Power and high power headers and sockets. Press-Fit headers and sockets. EMLB for “hot swap”.
|
|
Printer-friendly format