Epoxy used for filling voids and honeycomb core. Cures to a rigid, solvent-resistant material in one hour at 250F (121C). The compound has thixotropic properties for ease of application. Cured material is flame retardant. Meets the flammability requirements of F.A.R. 25.853 (a).

Structural two part paste adhesive featuring full stand alone FST properties, good fluid resistance and ease of design to flexible substrates of a wide variety.

3M™ Scotch-Weld™ Structural Void Filling Compound 3439 HT is a temperature-resistant, one-part, high-temperature curing low density void filling compound.

A two-part, low-density, flame-retardant epoxy compound that can be stored, applied, and cured at room temperature. This compound can be used for void-filling, edge-sealing, and complex gap-filling.

A two part, room temperature curing, low density void filling compound.

Two part RT cure low density Void Filler designed for honeycomb constructions of aircraft interiors.

High performance over a temperature range of -67F to 350F (-55C to 177C). Low density. Long worklife. Low volatile loss during cure.

Two-part, flame-retardant epoxy. Can be used for void filling, edge sealing and as an abradable compound in aircraft engines. Cures to a strong, low-density material within 48 hours at 75 degrees F (24 degrees C). Meets the flammability requirements of F.A.R. 25.853 (a) and (b). Reinforces honeycomb. Can be used for bonding inserts.

Extreme low density and weight. Pumpable. Full stand alone FST properties with patented non-halogen based FST system. Low flow for ease of application.

Deaerated product to minimize bubbles in final potting. Fast cure 91 hour). Low cure density. Low flow for ease of application. Excellent water and chemical resistance.

Two components can be stored at room temperature. Long work-lfe at room temperature. 1:1 ratio and thixotropic features for ease of application. Excellent water and chemical resistance.